Technical information
- Main application: High precision automated wafer dicing
- 6" Max wafer diameter
- 600um max wafer thickness
- 32um wide cut in silicon using the standard blade.
- Sample mounting with UV curable dicing tape.
Tool Overview
Responsible: Anders Kvennefors, Max Bäckström
Location: Room Q231, CBE-Lab outside cleanroom level 2
License and Booking Required: Yes
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