Technical information
- Main application: Ultrasonic wire bonding.
- Au or Al deep access wedge bonding (Default configuration: Au wedge)
- Au ball bonding, with sample heating up to 200C
- Wire diameter: 25µm
- Bump-bonding
- Programmable automated or semi-automated bonding available.
Tool Overview
Responsible:
Location: Room Q113
License and Booking Required: Yes
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