Technical information
  • Main application: thin film deposition via thermal evaporation
  • Materials available via thermal evaporation: Au, Al, Ni, NiCr, FeNi, Pd, Zn, Ti, Ge.
  • Materials available via sublimation: Cr and SiO.
  • Tilting and rotation of the substrate is possible.
  • Base pressure below 7x10-7mbar.
  • Maximum wafer size: 2"
Tool Overview

Responsible: Johan Stjernholm

Location: Room Q158, EVA-Lab (Level 1)

License and Booking Required: Yes

Documentation

User Manuals

Process

Staff Documents

Other Links

Safety Information

View on LIMS

FAQ

User Discussion Forum


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