• Main application: thin film deposition via thermal evaporation
• Materials available via thermal evaporation: Au, Al, Ni, NiCr, FeNi, Pd, Zn, Ti, Ge.
• Materials available via sublimation: Cr and SiO.
• Tilting and rotation of the substrate is possible.
• Base pressure below 7x10^-7mbar.
• Maximum wafer size: 2"

Responsible: Johan Stjernholm

Location: Room Q158, EVA-Lab (Level 1)

License and Booking Required: Yes

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