Technical information
- Main application: thin film deposition via thermal evaporation
- Materials available via thermal evaporation: Au, Al, Ni, NiCr, FeNi, Pd, Zn, Ti, Ge.
- Materials available via sublimation: Cr and SiO.
- Tilting and rotation of the substrate is possible.
- Base pressure below 7x10-7mbar.
- Maximum wafer size: 2"
Tool Overview
Responsible: David Fitzgerald
Location: Room Q158, EVA-Lab (Level 1)
License and Booking Required: Yes
Documentation
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