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changes.mady.by.user Peter Blomqvist

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changes.mady.by.user Luke Hankin

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Tool Summary


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titleTechnical information

  • Sputter deposition (PVD) system

  • Target

  • Tool Responsible: Peter Blomqvist & George Rydnemalm

  • Location: LNL, clean room first floor

  • License required: Yes

    • Tool information:

    Available target

    • materials: Au, Al, Ni, Mo, W, Ti, Si,

    SiO2

    • SiO2, TiN, ITO

    • 3 DC magnetrons (2") and 2 RF magnetrons

    4" wafer holder

    • (2")

    • Gases: Ar,

    N2

    • N2,

    O2

    • O2

    • Process chamber base pressure: low 10-7 mbar

    • Load-lock for quick and easy sample loading

    • QCM (Quartz Micro Balance)

  • FAQ

    • for monitoring of deposition rate and film thickness

    • Maximum wafer size: 4"



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    titleTool Overview

    Responsible: Johan Stjernholm 

    Location: Room Q158 - Level 1 (EVA )

    License and Booking Required: Yes



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    titleDocumentation
    Safety

    User Manuals

    Process

    Staff Documents

        



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    Safety Information

    View on LIMS

    FAQ

    User Discussion Forum