Technical information

  • Sputter deposition (PVD) system

  • Target materials: Au, Al, Ni, Mo, W, Ti, Si, SiO2, TiN, ITO

  • 3 DC magnetrons (2") and 2 RF magnetrons (2")

  • Gases: Ar, N2, O2

  • Process chamber base pressure: low 10-7 mbar

  • Load-lock for quick and easy sample loading

  • QCM (Quartz Micro Balance) for monitoring of deposition rate and film thickness

  • Maximum wafer size: 4"
Tool Overview

Responsible: Johan Stjernholm 

Location: Room Q158 - Level 1 (EVA )

License and Booking Required: Yes


Documentation

User Manuals

Process

Staff Documents

Other Links

Safety Information

View on LIMS

FAQ

User Discussion Forum



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