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titleTechnical information
  • Main application: Molecular Vapor Depostion tool for surface modification using self-assembled monolayers and atomic layer deposition.
  • Materials: SiO2, HfO, TiN, Al2O3, AlN
  • 8" max wafer diameter


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titleTool Overview

Responsible: Bengt Meuller/

Tool Summary

Tool Responsible:

Anders Kvennefors

Location:

 

  • Maximum wafer size: 

  • FAQ

    • Room Q258, (Level 2)

    License and Booking Required: Yes

        


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    titleDocumentation
    Safety

    User Manuals

    Process

    Staff Documents



         
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    titleOther Links

    Safety Information

    View on LIMS

        

    FAQ

    User Discussion Forum