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titleTool OverviewTechnical information
  • Adjustable and programmable carrier speed, rotation direction, download and backing pressure, plate speed and direction, as well as slurry feed rate.
  • Slurry  SF1 used as polishing media. Others available on request.
  • Templates for sample sizes of 10x8mm, 2" & 4" available. Others available on request.
  • 8" max wafer diameter can be polished


Responsible: Sarah McKibbin and Alex den Ouden

Location: Room Q156, EBL-Lab (Cleanroom Level 1)

License and Booking Required: Yes

Main application: Resist stripping, isotropic etching Si, SiO2 & SiNx.

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titleTechnical informationTool Overview

Responsible: Alexander den Ouden

Location: Room Q231, CBE-Lab outside cleanroom level 2

License and Booking Required: Yes

Main application: planarizing rough sample surfaces, removing thin layers of material

  • Plasma excitation: MW (2.45 GHz, up to 1000W).
  • Process gases: O2, Ar and CF4.
  • Isotropic etching  with minimum ion damage to samples.
  • Water cooled plate.
    • 6" max wafer diameter.



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    titleDocumentation

    User Manuals 

    Process

    Staff Documents

    for the tool





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    titleOther Links

    Safety

    View on LIMS

    FAQ