• Adjustable and programmable carrier speed, rotation direction, download and backing pressure, plate speed and direction, as well as slurry feed rate.
  • Slurry  SF1 used as polishing media. Others available on request.
  • Templates for sample sizes of 10x8mm, 2" & 4" available. Others available on request.
  • 8" max wafer diameter can be polished


Responsible: Max Bäckström Second responsible: Marcus Wcislek 

Location: Room Q231, CBE-Lab outside cleanroom level 2

License and Booking Required: Yes

Main application: planarizing rough sample surfaces, removing thin layers of material


It is of utmost importance that the tool is sprayed down properly with the water gun after use, such that no slurry remains on the tubes (drippers), holders, the tool head(s) or their back pressure fittings. When spraying down the head(s), don't forget the back pressure lines as shown in the video to the left, as those are especially sensitive to build up of dry slurry!




User Manuals 

Process

Staff Documents





Safety

View on LIMS

FAQ