Technical information
- Main application: High precision automated wafer dicing
- 6" Max wafer diameter
- 600um max wafer thickness
- 32um wide cut in silicon using the standard blade.
- Sample mounting with UV curable dicing tape.
Tool Overview
Responsible: Anders Kvennefors / Alexander den Ouden
Location: Room Q231, CBE-Lab outside cleanroom level 2
License and Booking Required: Yes
Documentation
Other Links
1 Comment
Lab Administrator
2021 Nov 26is there a user manual?