Technical information
  • Main application: High precision automated wafer dicing
  • 6" Max wafer diameter
  • 600um max wafer thickness
  • 32um wide cut in silicon using the standard blade.
  • Sample mounting with UV curable dicing tape.
Tool Overview

Responsible: Anders Kvennefors / Alexander den Ouden

Location: Room Q231, CBE-Lab outside cleanroom level 2

License and Booking Required: Yes




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1 Comment

  1. Lab Administrator

    is there a user manual?