You are viewing an old version of this page. View the current version.

Compare with Current View Page History

« Previous Version 29 Next »


Technical information
  • Main application: sputter deposition (PVD) of thin films

  • Available target materials: Au, Al, Ni, Mo, W, Ti, Si, SiO2, TiN, ITO

  • 3 DC magnetrons (2") and 2 RF magnetrons (2")

  • Gases: Ar, N2, O2

  • Process chamber base pressure: low 10-7 mbar

  • Load-lock for quick and easy sample loading
  • QCM (Quartz Micro Balance) for monitoring of deposition rate and film thickness

  • Maximum wafer size: 4"
Tool Overview

Responsible: Peter Blomqvist and George Rydnemalm

Location: Room Q158 - Level 1 (EVA )

License and Booking Required: Yes




  • No labels