Tool Summary

• Tool Responsible: Sarah McKibbin and Alex den Ouden
• Location:Room Q156, EBL-Lab (Cleanroom Level 1)
• License Required: Yes
• Booking Required: Yes
• Maximum wafer size: 6 inches
• Tool Information:

  • Plasma excitation: MW (2.45 GHz, up to 1000W)

  • Process gases: O2, Ar and CF4.

  • Isotropic etching with minimum ion damage to samples.

  • Ideal for etching Si, SiO₂, and polymers (resists), and resist stripping.

  • Water cooled plate.

  • 6" max wafer diameter.

• FAQ

Safety

User Manuals

Process

Staff Documents

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