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Tool Summary

  • Tool Responsible: Sarah McKibbin and Alex den Ouden

  • Location:Room Q156, EBL-Lab (Cleanroom Level 1)

  • License Required: Yes

  • Booking Required: Yes

  • Maximum wafer size: 6 inches

  • Tool Information:

    • Plasma excitation: MW (2.45 GHz, up to 1000W)
    • Process gases: O2, Ar and CF4.
    • Isotropic etching with minimum ion damage to samples.
    • Ideal for etching Si, SiO2, and polymers (resists), and resist stripping.
    • Water cooled plate.
    • 6" max wafer diameter.
  • FAQ

Safety

User Manuals

Process

Staff Documents


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