Tool Overview
Responsible: Bengt Meuller
Location: Room
License and Booking Required: Yes
Main application:
Technical information
- Plasma excitation: MW (2.45 GHz, up to 1000W).
- Process gases: O2, Ar and CF4.
- Isotropic etching with minimum ion damage to samples.
- Water cooled plate.
- 6" max wafer diameter.
Documentation
Documents for the tool
Other Links