Wall-mounted Rapid Thermal Processing (RTP) system, RTP-1200-100 from UniTemp GmbH. Three gas options: N2, O2 or forming gas (20% of H2 + 80% of N2). It is not possible to have vacuum in the system. Processing for up to 4 inch wafers: either 4 inch wafers or samples mounted on 4 inch carriers. Temperature/time limitations: max 60 min for T < 400°C, max 30 min for 400°C < T < 600°C, max 15 min for 600°C < T < 800°C, max 5 min for 800°C < T < 1000°C. The max temperature ramp up rate is 150°C/s. Up to 100 steps programmable processes.
