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Tool Summary

  • Tool Responsible: Peter Blomqvist & George Rydnemalm

  • Location: LNL, clean room first floor

  • License required: Yes

  • Tool information:

    • Available target materials: Au, Ni, Mo, W, Ti, Si, SiO2, TiN, ITO
    • 3 DC magnetrons and 2 RF magnetrons
    • 4" wafer holder
    • Gases: Ar, N2, O2
    • Process chamber base pressure: low 10-7 mbar
    • QCM (Quartz Micro Balance)
  • FAQ

Safety

User Manuals

Process

Staff Documents


    




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