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Old Version 5

changes.mady.by.user Sarah McKibbin

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New Version Current

changes.mady.by.user Alexander Den Ouden

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Tool Summary

  • Tool Responsible: Dmitry Suyatin

  • Location:  Q158 (Level 1 - EVA room)

  • License Required: Yes

  • Booking Compulsory: Yes

  • Tool Information:



Wall-mounted
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titleTechnical information
  • Main application: 
  • Rapid Thermal Processing (RTP)
system, RTP-1200-100 from UniTemp GmbH. Three gas options
  • Available gases: N2, O2 or forming gas (
20%
  • 5% of H2 +
80%
  • 95% of N2).
It is not possible to have vacuum in the system. Processing for up to 4 inch wafers: either 4 inch wafers or samples mounted on 4 inch carriers. Temperature/time limitations: max 60 min for T < 400°C, max 30 min for
  • 4" max wafer diameter, wafer carrier available.
  • Temperature dependent time limits
    • T < 400°C: 60 min
    • 400°C < T < 600°C
, max 15 min for
    • : 30 min
    • 600°C < T < 800°C
, max 5 min for
    • : 15 min
    • 800°C < T < 1000°C
. The max
    • : 5 min
  • Max temperature ramp up rate is 150°C/s.
  • Up to 100 steps programmable processes.


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titleTool Overview

Responsible: Alexander Den Ouden

Location: Room Q158, EVA-Lab (Cleanroom Level 1)

License and Booking Required: Yes

Model and supplier: RTP-1200-100 from UniTemp GmbH.

   


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titleDocumentation
Safety

User Manuals

Process

Staff Documents



     
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titleOther Links

Safety Information

View on LIMS

    

FAQ