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titleTool Overview

Responsible: Bengt Meuller

Location: Room

License and Booking Required: Yes

Main application:


  • Plasma excitation: MW (2.45 GHz, up to 1000W).
  • Process gases: O2, Ar and CF4.
  • Isotropic etching  with minimum ion damage to samples.
  • Water cooled plate.
    • 6" max wafer diameter.
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    titleTechnical information



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    titleDocumentation

    Documents for the tool



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    titleOther Links

    View on LIMS


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