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title	Technical information

Main application: Resist stripping, isotropic etching Si, SiO2 & SiNx.
Process gases: O2, N2
Isotropic etching with minimum ion damage to samples.
Water cooled plate.
4" max wafer diameter.

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title	Tool Overview

Responsible: Alex den Ouden

Location: Room Q158, EVA-Lab (Cleanroom Level 1)

License and Booking Required: Optional

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title	Documentation

User Manuals

Process

Staff Documents

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title	Other Links

Safety Information

View on LIMS

FAQs

User Discussion Forum