Technical information
- Main application: Resist stripping, isotropic etching Si, SiO2 & SiNx.
- Process gases: O2, N2
- Isotropic etching with minimum ion damage to samples.
- Water cooled plate.
- 4" max wafer diameter.
Tool Overview
Responsible: Alex den Ouden
Location: Room Q158, EVA-Lab (Cleanroom Level 1)
License and Booking Required: Optional
Documentation
Other Links