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• Main application: Rapid Thermal Processing (RTP)
• Available gases: N2, O2 or forming gas (20% of H2 + 80% of N2).
• 4" max wafer diameter, wafer carrier available.
• Temperature dependent time limits
  • T < 400°C: 60 min
  • 400°C < T < 600°C : 30 min
  • 600°C < T < 800°C: 15 min
  • 800°C < T < 1000°C: 5 min

• Max temperature ramp up rate is 150°C/s.
• Up to 100 steps programmable processes.

Responsible: Dmitry Suyatin

Location: Room Q158, EVA-Lab (Cleanroom Level 1)

License and Booking Required: Yes

Model and supplier: RTP-1200-100 from UniTemp GmbH.

User Manuals

Process

Staff Documents

Safety Information

View on LIMS

FAQ