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titleTechnical information
  • Adjustable and programmable carrier speed, rotation direction, download and backing pressure, plate speed and direction, as well as slurry feed rate.
  • Slurry  SF1 used as polishing media. Others available on request.
  • Templates for sample sizes of 10x8mm or 2" available. Others available on request.
  • 8" max wafer diameter can be polished


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titleTool Overview

Responsible: Alexander den Ouden

Location: Room Q231, CBE-Lab outside cleanroom level 2

License and Booking Required: Yes

Main application: planarizing rough sample surfaces, removing thin layers of material



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titleDocumentation

User Manuals 

Process - Logitech Orbis CMP

Staff Documents - Logitech Orbis CMP





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titleOther Links

Safety

View on LIMS

FAQ - Logitech Orbis CMP


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