Versions Compared

Old Version 19

changes.mady.by.user Peter Blomqvist

Saved on

compared with

New Version 20

changes.mady.by.user Sarah McKibbin

Saved on

Key

  • This line was added.
  • This line was removed.
  • Formatting was changed.





Image Modified

Tool Summary


Panel
borderColor#BFB8AF
bgColorwhite
titleColorBlack
borderWidth2
titleBGColor#DCE9EE
borderStylesolid
titleTechnical information

  • Main application: Sputter deposition of thin films

  • Tool Responsible: Peter Blomqvist & George Rydnemalm

  • Location: LNL, clean room first floor

  • License required: Yes

  • Booking required: Compulsory

    • Tool information:

    • Available target materials: Au, Al, Ni, Mo, W, Ti, Si, SiO2, TiN, ITO

    • 3 DC magnetrons and 2 RF magnetrons

  • 4" wafer holder

    • Gases: Ar, N2, O2

    • Process chamber base pressure: low 10-7 mbar

    • QCM (Quartz Micro Balance)

    • Maximum wafer size: 4"



    Panel
    borderColor#BFB8AF
    bgColorwhite
    titleColorBlack
    borderWidth2
    titleBGColor#DCE9EE
    borderStylesolid
    titleTool Overview

    Responsible: Peter Blomqvist and George Rydnemalm

    Location: Room Q158 - Level 1 (EVA )

    License and Booking Required: Yes


    FAQ

    Safety

    User Manuals

    Process

    Staff Documents


        



    Panel
    borderColor#BFB8AF
    bgColorwhite
    titleColorBlack
    borderWidth2
    titleBGColor#DCE9EE
    borderStylesolid
    titleDocumentation

    User Manuals

    Process

    Staff Documents



    Panel
    borderColor#BFB8AF
    bgColorwhite
    titleColorBlack
    borderWidth2
    titleBGColor#DCE9EE
    borderStylesolid
    titleOther Links

    Safety Information

    View on LIMS

    FAQ