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Tool Summary

  • Tool Responsible: Dmitry Suyatin

  • Location:  Q158 (Level 1 - EVA room)

  • License Required: Yes

  • Booking Compulsory: Yes

  • Tool Information:

Wall-mounted
Panel
borderColor#BFB8AF
bgColorwhite
titleColorBlack
borderWidth2
titleBGColor#DCE9EE
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titleTechnical information
  • Main application: 
  • Rapid Thermal Processing (RTP) system,
RTP-1200-100 from UniTemp GmbH. Three gas options
  • Gases: N2, O2 or forming gas (20% of H2 + 80% of N2).
It is not possible to have vacuum in the system. Processing for up to 4 inch wafers: either 4 inch wafers or samples mounted on 4 inch carriers.
  • No vacuum.
  • 4" max wafer diameter, wafer carrier available.
  • Temperature/time limitations: max 60 min for T < 400°C, max 30 min for 400°C < T < 600°C, max 15 min for 600°C < T < 800°C, max 5 min for 800°C < T < 1000°C.
The max
  • Max temperature ramp up rate is 150°C/s.
  • Up to 100 steps programmable processes.


Panel
borderColor#BFB8AF
bgColorwhite
titleColorBlack
borderWidth2
titleBGColor#DCE9EE
borderStylesolid
titleTool Overview

Responsible: Dmitry Suyatin

Location: Room Q158, EVA-Lab (Cleanroom Level 1)

License and Booking Required: Yes

Model and supplier: RTP-1200-100 from UniTemp GmbH.

Safety

User Manuals

Process

Staff Documents


     View on LIMS

    

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