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titleTechnical information
  • Main application: Ultrasonic wire bonding.
  • Au or Al deep access wedge bonding (Default configuration: Au wedge)
  • Au ball bonding, with sample heating up to 125C
  • Wire diameter: 25µm
  • Bump-bonding
  • Programmable automated or semi-automated bonding available.

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titleTool Overview

Responsible: Alexander Den Ouden

Location: Room Q113

License and Booking Required: Yes

Main application: Resist stripping, isotropic etching Si, SiO2 & SiNx.



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titleDocumentation

User Manuals

Process

Staff Documents



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titleOther Links

Safety Information 

View on LIMS

FAQ


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