Main application: Ultrasonic wire bonding.
Au or Al deep access wedge bonding (
Default configuration: Au wedge)
Au ball bonding, with samp
le heating up to 125C
Wire diameter: 25µm
Bump-bonding
Programmable automated or semi-automated bonding available.
Responsible:
Alexander Den Ouden
Location: Room Q113
License and Booking Required: Yes
User Manuals
Process
Staff Documents
Safety Information
View on LIMS
FAQ
