Tool Summary

• Tool Responsible: Peter Blomqvist & George Rydnemalm

• Location: LNL, clean room first floor

• License required: Yes

• Booking required:

  Yes

  Compulsory

• Tool information:

  • Available target materials: Au, Al, Ni, Mo, W, Ti, Si, SiO₂, TiN, ITO

  • 3 DC magnetrons and 2 RF magnetrons

  • 4" wafer holder

  • Gases: Ar, N₂, O₂

  • Process chamber base pressure: low 10^-7 mbar

  • QCM (Quartz Micro Balance)

• FAQ

Safety

User Manuals

Process

Staff Documents