Tool Summary
Tool Responsible: Sarah McKibbin and Alex den Ouden
Location:Room Q156, EBL-Lab (Cleanroom Level 1)
License Required: Yes
Booking Required: Yes
Maximum wafer size: 6 inches
Tool Information:
- Plasma excitation: MW (2.45 GHz, up to 1000W)
- Process gases: O2, Ar and CF4.
- Isotropic etching with minimum ion damage to samples.
- Ideal for etching Si, SiO2, and polymers (resists), and resist stripping.
- Water cooled plate.
- 6" max wafer diameter.
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