Technical information
- Adjustable and programmable carrier speed, rotation direction, download and backing pressure, plate speed and direction, as well as slurry feed rate.
- Slurry SF1 used as polishing media. Others available on request.
- Templates for sample sizes of 10x8mm, 2" & 4" available. Others available on request.
- 8" max wafer diameter can be polished
Tool Overview
Responsible: Alexander den Ouden
Location: Room Q231, CBE-Lab outside cleanroom level 2
License and Booking Required: Yes
Main application: planarizing rough sample surfaces, removing thin layers of material
Documentation
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