Tool Summary

• Tool Responsible: Dmitry Suyatin

• Location:  Q258 (Level 2 - Cluster Tool room)

• License Required: Yes

• Booking Compulsory: Yes

• Tool Information:

• Inductively coupled plasma reactive ion etching (ICP-RIE) system Apex SLR from Plasma-Therm LLC. The system is designed for Chlorine-based well controlled nanoscale etching and atomic layer etching (ALE) of various materials, mostly III-V semiconductors, but also Si, metals (e.g. Cr) and polymers (resists). Unprotected surfaces of the following materials are not allowed: glasses, noble metals (Au, Ag, Pt, Cu, Pd), heavy metals (Cd, Pb, Zn) and certain types of polymers (e.g. silicones). In total, 6 process gases are presently available: Cl₂, BCl₃, CH₄, Ar, O₂ and H₂. The system is normally configured for clamping 2 inch wafers. Helium back side cooling. Wafer clamps for 4 inch, 6 inch and 8 inch wafers are also available. Substrate temperature control: -40°C to 170°C. Plasma excitation: ICP (2 MHz, 1 kW) and RF (13.56 MHz, 300 W). Process pressure: 3 - 100 mTorr. The system is equipped with an optical emission spectroscopy (OES) system for determining process endpoint.

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