Technical information
- Main application: Low power descum and resist etching.
- Parallel plate RF etcher.
- Max Power: 30 W.
- Min Power: 1 W.
- Process Gases: O2, Ar, N2
- Low power descum and residuals removal.
- 3" max wafer diameter
Tool Overview
Responsible: Sarah McKibbin and Alex den Ouden
Location: Room Q156, EBL-Lab (Cleanroom Level 1)
License and Booking Required: Yes
Documentation