• Main application: Molecular Vapor Depostion tool for surface modification using self-assembled monolayers and atomic layer deposition.
• Materials: SiO2, HfO, TiN, Al2O3, AlN
• 8" max wafer diameter

Responsible: Anders Kvennefors/ George Rydnemalm

Location: Room Q2XX, (Level 2)

License and Booking Required: Yes

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