Tool Summary

• Tool Responsible: Dmitry Suyatin

• Location:  Q156 (Level 1 - EBL room)

• License Required: Yes

• Booking Compulsory: Yes

• Tool Information:

Table-top Reactive Ion Etching (RIE) system Sirus T2 Plus from Trion Technology. The system is designed for etching Si, SiO₂, Si₃N₄, W, Mo and polymers (resists) with fluorine-based chemistry. Unprotected surfaces of the following materials are not allowed: glasses, noble metals (Au, Ag, Pt, Cu, Pd), heavy metals (Cd, Pb, Zn) and certain types of polymers (e.g. silicones). In total, 5 gases available: CF₄, CHF₃, SF₆, O₂ and Ar. Up to 8 inch wafer substrate size. No wafer clamping. Room temperature processing. Plasma excitation: RF (13.56 MHz, up to 600W). Process pressure down to 10 mTorr. The system is equipped with Intellevation LEP400 laser interferometric etch depth monitor and end point detector.

• FAQ

Safety

User Manuals

Process

Staff Documents

     View on LIMS