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Tool Summary


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titleTechnical information
  • Main application: Resist stripping, isotropic etching Si, SiO2 & SiNx.

  • Tool Responsible: Sarah McKibbin and Alex den Ouden

  • Location:Room Q156, EBL-Lab (Cleanroom Level 1)

  • License Required: Yes

  • Booking Required: Yes

  • Maximum wafer size: 6 inches

    • Tool Information:
    • Plasma excitation: MW (2.45 GHz, up to 1000W).
    • Process gases: O2, Ar and CF4.
    • Isotropic etching with minimum ion damage to samples
    .Ideal for etching Si, SiO2, and polymers (resists), and resist stripping
    • .
    • Water cooled plate.
    • 6" max wafer diameter.


    Panel
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    titleTool Overview

    Responsible: Sarah McKibbin and Alex den Ouden

    Location: Room Q156, EBL-Lab (Cleanroom Level 1)

    License and Booking Required: Yes


    Panel
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    titleDocumentation

  • FAQ

    • Safety

    User Manuals

    Process

    Staff Documents



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    titleOther Links

    Safety Information 

    View on LIMS

        

    FAQs

    User Discussion Forum