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Tool Summary

  • Tool Responsible: Dmitry Suyatin

  • Location:  Q258 (Level 2 - Cluster Tool room)

  • License Required: Yes

  • Booking Compulsory: Yes



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    titleTechnical information
    Tool Information:
    • Inductively coupled plasma reactive ion etching (ICP-RIE)
    system Apex SLR from Plasma-Therm LLC. The system is designed for Chlorine-based well controlled nanoscale etching
    • .
    • Plasma excitation: ICP (2MHz, 1kW) and RF (13.56MHz, 300W).

    • Process gases: Cl2, BCl3, CH4, Ar, O2 and H2.

    • Process pressure: 3 - 100 mTorr. 
    • 8" max wafer diameter. Standard config. for 2" wafer clamping.
    • Substrate Temperature control: -40°C to 170°C..

    • He back side cooling.

    • Optical emission spectroscopy (OES) endpoint detection system.

    • Main application: Controlled nanoscale etching  and atomic layer etching (ALE) of
    various materials, mostly
    • III-V semiconductors,
    but also
    • Si, metals and polymers with chlorine-based chemistry.


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    titleTool Overview

    Responsible: Luke Hankin 

    Location: Room Q258, Cluster Tool room (Level 2)

    License and Booking Required: Yes

    Supplier: Plasma-Therm LLC

    Model: APEX SLR



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    titleDocumentation

    User Manuals

    Process

    Staff Documents



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    Safety Information

    View on LIMS

    FAQ

    User Discussion Forum



    (e.g. Cr) and polymers (resists).
    Info

    Unprotected surfaces of the following materials are not allowed: glasses, noble metals (Au, Ag, Pt, Cu, Pd), heavy metals (Cd, Pb, Zn) and certain types of polymers (e.g. silicones).

    In total, 6 process gases are presently available: Cl2, BCl3, CH4, Ar, O2 and H2. The system is normally configured for clamping 2 inch wafers. Helium back side cooling.

    Wafer clamps for 4 inch, 6 inch and 8 inch wafers are also available.

    Substrate temperature control: -40°C to 170°C. Plasma excitation: ICP (2 MHz, 1 kW) and RF (13.56 MHz, 300 W). Process pressure: 3 - 100 mTorr. The system is equipped with an optical emission spectroscopy (OES) system for determining process endpoint.

  • FAQ

    • Safety

    User Manuals

    Process

    Staff Documents

         View on LIMS