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MJB4 Deep UV Mask AlignerImage Modified


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titleTechnical information
  • Wavelength: 240nm to 320nm.
  • Deep UV contact mask aligner, strongly damped soft UV region.
  • Exposure of small pieces and full wafers.
  • 4" max wafers.
  • Mask sizes 3.5", 4" and 5".


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titleTool
Summary
Overview
Tool

Responsible: Sarah

Mckibbin

McKibbin

Location:

 

  • Maximum wafer size: 

  • FAQ

    • Room Q161, UVL - Lab (Level 1)

    License and Booking Required: Yes

      


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    titleDocumentation
    Safety

    User Manuals

    Process

    Staff Documents



         
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    titleOther Links

    Safety Information 

    View on LIMS

        

    FAQ

    User Discussion Forum