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titleTechnical information
  • Main application: Low power descum and resist etching.
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Tool Summary

  • Tool Responsible: Sarah McKibbin

  • Location: Q156 - EBL lab

  • License Required: Yes

  • Booking Compulsory: Yes 

    • Tool Information:
    • Parallel plate RF etcher. 
    • Max Power: 30 W.
    • Min Power: 1 W.
    • Process Gases: O2, Ar, N2
    • Low power descum and residuals removal.
    • 3" max wafer diameter

  • FAQ


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    titleTool Overview

    Responsible: Sarah McKibbin and Alex den Ouden

    Location: Room Q156, EBL-Lab (Cleanroom Level 1)

    License and Booking Required: Yes



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    titleDocumentation
    Safety

    User Manuals

    Process

    Staff Documents



         
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    Safety Information 

    View on LIMS

        

    FAQ

    User Discussion Forum