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titleTechnical information
  • Main application: Low power descum and resist etching.
  • Parallel plate RF etcher. 
  • Max Power: 30 W.
  • Min Power: 1 W.
  • Process Gases: O2, Ar, N2
  • Low power descum and residuals removal.
  • 3" max wafer diameter

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titleTool Overview

Responsible: Sarah McKibbin and Alex den Ouden

Location: Room Q156, EBL-Lab (Cleanroom Level 1)

License and Booking Required: Yes



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titleDocumentation

User Manuals

Process

Staff Documents



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titleOther Links

Safety Information 

View on LIMS

FAQ

User Discussion Forum