Versions Compared

Old Version 13

changes.mady.by.user Sarah McKibbin

Saved on

compared with

New Version 14

changes.mady.by.user Sarah McKibbin

Saved on

Key

  • This line was added.
  • This line was removed.
  • Formatting was changed.


Image Modified


Panel
borderColor#BFB8AF
bgColorwhite
titleColorBlack
borderWidth2
titleBGColor#DCE9EE
borderStylesolid
titleTechnical information
  • Main application: Resist stripping, isotropic etching Si, SiO2 & SiNx.
  • Plasma excitation: MW (2.45 GHz, up to 1000W).
  • Process gases: O2, Ar and CF4.
  • Isotropic etching with minimum ion damage to samples.
  • Water cooled plate.
  • 6" max wafer diameter.


Panel
borderColor#BFB8AF
bgColorwhite
titleColorBlack
borderWidth2
titleBGColor#DCE9EE
borderStylesolid
titleTool Overview

Responsible: Sarah McKibbin and Alex den Ouden

Location: Room Q156, EBL-Lab (Cleanroom Level 1)

License and Booking Required: Yes


Panel
borderColor#BFB8AF
bgColorwhite
titleColorBlack
borderWidth2
titleBGColor#DCE9EE
borderStylesolid
titleDocumentation

User Manuals

Process

Staff Documents



Panel
borderColor#BFB8AF
bgColorwhite
titleColorBlack
borderWidth2
titleBGColor#DCE9EE
borderStylesolid
titleOther Links

Safety Information 

View on LIMS

FAQs


...