Tool Summary
- Tool Responsible: Sarah McKibbin and Alex den Ouden
- Location:Room Q156, EBL-Lab (Cleanroom Level 1)
- License Required: Yes
- Booking Required: Yes
- Maximum wafer size: 6 inches
- Tool Information:
Plasma excitation: MW (2.45 GHz, up to 1000W)
Process gases: O2, Ar and CF4.
Isotropic etching with minimum ion damage to samples.
Ideal for etching Si, SiO2, and polymers (resists), and resist stripping.
Water cooled plate.
6" max wafer diameter.
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