Tool Summary
Tool Responsible: Dmitry Suyatin
Location:
Q156Q158 (Level 1 -
EBLEVA room)
License Required: Yes
Booking Compulsory: Yes
Tool Information:
Table-top Reactive Ion Etching (RIE) system Sirus T2 Plus from Trion Technology. The system is designed for etching Si, SiO2, Si3N4, W, Mo and polymers (resists) with fluorine-based chemistry. Unprotected surfaces of the following materials are not allowed: glasses, noble metals (Au, Ag, Pt, Cu, Pd), heavy metals (Cd, Pb, Zn) and certain types of polymers (e.g. silicones). In total, 5 gases available: CF4, CHF3, SF6, O2 and Ar. Up to 8 inch wafer substrate size. No wafer clamping. Room temperature processing. Plasma excitation: RF (13.56 MHz, up to 600W). Process pressure down to 10 mTorr. The system is equipped with Intellevation LEP400 laser interferometric etch depth monitor and end point detector.
Safety
User Manuals
Process
Staff Documents
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